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Metals

  1. 2023
  2. Vinh Dinh Nguyen, Que Nguyen Van, Nguyen Thi Hong Hoa, Nguyen To Hoan, Nghia Nguyen Trong, Nguyen Thi Ngoc Linh, Bui Minh Quy, Thi Thu Ha Pham, Phuoc Nguyen Van (2023). Enhancement of Leaching Copper from Printed Circuit Boards of Discarded Mobile Phones Using Ultrasound–Ozone Integrated Approach. Metals, 13(1145). [14]. https://doi.org/(...)/10.3390/met13061145